• Publication

Publication

Accepted papers by AICS 2022 will be published as conference proceeding by Journal of Physics: Conference Series (JPCS) (Print ISSN: 1742-6588) and submitted to be indexed in EI Compendex.


Selected excellent papers will be published by the following SCI journals:

1. Special Issue "AI-Based Image Processing" with Applied Sciences (ISSN 2076-3417), SCI-indexed, IF 2.679

Topics include:

Image processing algorithms;

Image analytics;

Medial image processing;

Biomedical image analysis;

Image generation;

Image restoration and enhancement;

Image compression;

Edge detection;

Image segmentation;

Semantic segmentation;

Image classification;

Image inpainting;

Image captioning;

Feature detection and extraction;

Content-based image retrieval;

Optical character recognition;

Face recognition;

Emotion recognition;

Gesture recognition;

Object recognition and tracking.

Detailed information can be found at https://www.mdpi.com/journal/applsci/special_issues/AI_Based_Image.


2. Special Issue "Toward Performance Optimization of Wireless Sensor Networks and Sensor Node Devices in Environmental Monitoring" with Sensors, SCI-indexed, IF 3.576

Topics include:

cost (of node, energy consumption, maintenance);

energy (self-powered sensors, stability, environmental protection);

communication (security, scalability);

data processing (distributed, big data, robustness);

WSNs design and validation;

Artificial intelligence in WSNs;

Industrial WSNs;

Body Sensor Networks;

Flexible sensors;

Novel sensor device for WSNs.

Detailed information can be found at https://www.mdpi.com/journal/sensors/special_issues/WSN_loT_EM.


3. Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems" with Processes, SCI-indexed, IF 2.847

Topics include:

Micro/nano fabrication technology related to 3D integration, e.g., Cu–Cu pilar bump bonding, high-density RDL, TSV fabrication, Cu pillar, wafer bonding, etc.;

2.5D/3D heterogeneous integration, fan-out packaging, 3D hybrid integration, RF 3D integration, 3D passive device, 3D antenna, 3D heterogeneous opto-electronic integration, and thermal management;

Design Automation, process/device/packaging simulation, and thermal mechanical reliability of 3D integration;

Novel materials, components, circuits and technology to be used in 3D integration, e.g., 2D materials, triboelectronic nanogenerator, artificial intelligence, etc.

Detailed information can be found at https://www.mdpi.com/journal/processes/special_issues/TDIC.