Accepted papers by AICS 2022 will be published as conference proceeding by Journal of Physics: Conference Series (JPCS) (Print ISSN: 1742-6588) and submitted to be indexed in EI Compendex.
Selected excellent papers will be published by the following SCI journals:
1. Special Issue "AI-Based Image Processing" with Applied Sciences (ISSN 2076-3417), SCI-indexed, IF 2.679
Image processing algorithms;
Medial image processing;
Biomedical image analysis;
Image restoration and enhancement;
Feature detection and extraction;
Content-based image retrieval;
Optical character recognition;
Object recognition and tracking.
Detailed information can be found at https://www.mdpi.com/journal/applsci/special_issues/AI_Based_Image.
2. Special Issue "Toward Performance Optimization of Wireless Sensor Networks and Sensor Node Devices in Environmental Monitoring" with Sensors, SCI-indexed, IF 3.576
cost (of node, energy consumption, maintenance);
energy (self-powered sensors, stability, environmental protection);
communication (security, scalability);
data processing (distributed, big data, robustness);
WSNs design and validation;
Artificial intelligence in WSNs;
Body Sensor Networks;
Novel sensor device for WSNs.
Detailed information can be found at https://www.mdpi.com/journal/sensors/special_issues/WSN_loT_EM.
3. Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems" with Processes, SCI-indexed, IF 2.847
Micro/nano fabrication technology related to 3D integration, e.g., Cu–Cu pilar bump bonding, high-density RDL, TSV fabrication, Cu pillar, wafer bonding, etc.;
2.5D/3D heterogeneous integration, fan-out packaging, 3D hybrid integration, RF 3D integration, 3D passive device, 3D antenna, 3D heterogeneous opto-electronic integration, and thermal management;
Design Automation, process/device/packaging simulation, and thermal mechanical reliability of 3D integration;
Novel materials, components, circuits and technology to be used in 3D integration, e.g., 2D materials, triboelectronic nanogenerator, artificial intelligence, etc.
Detailed information can be found at https://www.mdpi.com/journal/processes/special_issues/TDIC.